Polyimide for Flexible Organic Electronic Device Substrates
Seung Woo Lee (†)
For flexible organic electronic device substrates, polymer materials should provide high gas barriers, flexibility, toughness and processability and desirable thermal and chemical properties. Of the many available polymeric materials, polyimides (PIs) have been widely used in the electronic device industry due to their high glass transition temperature, dimensional stability and heat resistance, as well as their excellent mechanical, adhesion and dielectric properties. Several concepts of colorless PI films have recently been proposed that reduce charge-transfer complexation by introducing fluorine groups, asymmetrical and bulky pendent units, or alicyclic units in the polymer structure to overcome the drawbacks of PI films.